Industry View: Doug Wong of Toshiba on the Future of Memory
Kristin Lewotsky
EETimes (7/12/2013 03:45 PM EDT)
To read the full article, click here
Related Semiconductor IP
- Hyper-Bandwidth Multichannel Memory Subsystem
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- Flash Memory LDPC Decoder IP Core
- HYPERBUS™ Memory Controller
- High Bandwidth Memory 3 (HBM3/3E) IP optimized for Samsung SF4X
Related News
- The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
- RISC-V: Shaping the Future of Mobility with Open Standards and Strong Partnership
- Chips&Media and Visionary.ai Unveil the World’s First AI-Based Full Image Signal Processor, Redefining the Future of Image Quality
- Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing
Latest News
- ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI