Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process
Grenoble, France – October 19, 2018 -- The race toward the lowest power consumption and the longest battery life is faster than ever with regards to IoT devices, and particularly for Bluetooth Low Energy and Low Power MCU. SoC architects have defined three main challenges for these autonomous IoT applications:
- reducing leakage to less than 0.5 μA, as IoT devices are sleeping by default
- mastering power consumption during transition time, from sleep to active mode
- reducing dynamic power consumption
To meet these challenges Dolphin Integration has added a new mode to its memory, the Nap mode. This enhanced stand-by mode enables up to 75 % reduction - depending on the instance - of the leakage power with only a single clock cycle wake up time. SpRAM RHEA-LL is ten times less leaky than competition memory and up to 20 % denser. This architecture, already silicon proven in GF® 55 LPe, has been migrated to the GF® 55 LPx process and has already been chosen by one of the biggest US chipset maker.
”The RHEA architecture is one of our flagship SpRAM architectures,” said Frederic Masson, Business Operation Manager at Dolphin Integration. ”We have set an ambitious performance target to provide our customers with crucial differentiating factors in today's competitive market. We reached it”.
About Dolphin Integration
Dolphin Integration, now a registered trademark of Dolphin Design SAS, is an integrated circuit design center and exporter of integrated circuits and components (virtual, analog and digital) for high volume manufacturing. As a major contributor to the emergence of a microelectronics design and following the explosive growth trends in semiconductor design, Dolphin Integration’s mission is to become a global player within the specialized market of service design and optimization of integrated circuits for very low energy consumption. The company's products focus on serving the needs of dynamic consumer and industrial markets such as IoT, mobile, and automotive, as well as those of the European defense design industry.
If you liked reading our announcement please write to us at contact@dolphin.fr or visit us www.dolphin-integration.com
Related Semiconductor IP
- RAM 8b, 16b, and 32b data widths - TSMC 180nm
- 3D Resistive RAM - High-Density Memory
- Resistive RAM - High-Performance Memory
- APB I/F for Fabric Ram Block
- AHB I/F for Fabric Ram Block
Related News
- PixArt Imaging selects voltage regulators IPs from Dolphin Integration for its ultra-low power MCU Sensor in 40 nm
- Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications
- GlobalFoundries Acquires Renesas' Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications
- Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing