Architect of CHIPS Act Speaks on Its Impact
By Alan Patterson, EETimes (August 1, 2022)
In an exclusive interview with EE Times, Keith Krach, former Under Secretary of State for Economic Growth, Energy, and the Environment in the Trump administration, speaks on the significance of the CHIPS Act, which has since been passed by the House in a 243–187 vote.
It has yet to be signed into law by President Joe Biden.
Along with former Secretary of State Mike Pompeo, Krach is one of the key people who helped shape the CHIPS Act. In May 2020, Krach’s effort led to an agreement by Taiwan Semiconductor Manufacturing Co. (TSMC) to build a $12 billion 5-nm chip fab in the U.S., the most advanced facility of its kind in the nation.
Krach is also an accomplished businessman as former chairman of DocuSign and co-founder of software company Ariba. Here are Krach’s thoughts on the impact the stimulus measures will have on the American semiconductor industry.
First of all, Keith, thank you very much for taking time out of your schedule today. I know you as the person who helped facilitate TSMC’s Arizona project.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- With CHIPS Act, US Risks Building a White Elephant
- U.S. Passes CHIPS Act, Increasing Restrictions on China Lead to Rising Geopolitical Risk, Says Trendforce
- Opinion: CHIPS Act Escalates Long-Standing U.S.-China Tech Rivalry
- Supply Chain Experts Weigh In on CHIPS Act
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications