Chip Equipment Becomes Trade War's Latest Battlefield
By Luffy Liu, EETimes (May 27, 2020)
The U.S. has issued a new set of trade rules that hamper American-made semiconductor equipment sales to China. As a result, telecom and networking giant Huawei Technologies reportedly is trying to persuade Samsung and TSMC to build an advanced production line that does not use U.S. equipment.
Under the latest trade regulation, fabless semiconductor companies are worried they will be the next target of sanctions by the United States.
TSMC should strongly support non-U.S. semiconductor material and equipment suppliers, according to industry analyst Lu Xingzhi. However, TSMC – which announced it would build a fab in the U.S. – seems hesitant to act on Huawei’s request.
To read the full article, click here
Related Semiconductor IP
- Xtal Oscillator on TSMC CLN7FF
- Wide Range Programmable Integer PLL on UMC L65LL
- Wide Range Programmable Integer PLL on UMC L130EHS
- Wide Range Programmable Integer PLL on TSMC CLN90G-GT-LP
- Wide Range Programmable Integer PLL on TSMC CLN80GC
Related News
- TSMC to Face Inventory Glut Caused by US-China Trade War
- Lexra fires 32-bit volley in CPU core war
- Intellectual property trade center eyes Japan takeoff
- Japan gets its own IP trade center
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing