CEVA Licenses Xpert-Teak DSP Platform To Sharp For Portable Multimedia Devices
DSP Platform Selected for Video and Audio Application Processing on Portable Multimedia Devices
SAN JOSE, Calif. - November 16, 2004 - CEVA, Inc. (NASDAQ: CEVA, LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communication solutions to the semiconductor industry, today announced that it has licensed the Xpert-Teak DSP platform to the Integrated Circuits Group of Sharp Corporation, targeting video and rich-media image application processing on Sharp's portable multimedia devices and mobile phones.
Sharp's adoption of CEVA Xpert-Teak exploits the platform's high performance at very low power in multimedia application processing for various SoC designs. In deploying Xpert-Teak across their multimedia product range, Sharp breaks the cycle of investing in a new DSP architecture for each new application, and exploits the cost and time-to-market advantages of reusable DSP platforms.
"Sharp's adoption of our Xpert-Teak DSP platform across the multimedia product line in the semiconductor division is a tremendous endorsement of CEVA," commented Chet Silvestri, President and CEO of CEVA. "For next generation devices, CEVA's DSP cores enable important partners such as Sharp focus on developing differentiated and leading solutions in a rapid time-to-market."
About CEVA Xpert-Teak
The Xpert-Teak subsystem is a complete, licensable, DSP subsystem for low-power, low-cost, programmable, DSP-based SoC designs targeted at low-power and high performance applications such as wireless baseband and application processing, digital cameras, consumer and professional audio, VoIP applications and other emerging markets. Built around CEVA's widely adapted dual-MAC CEVA-Teak DSP Core, it is fully synthesizable and process-independent, and can be incorporated into a highly integrated SoC. CEVA Xpert-Teak includes all required hardware peripherals and incorporates on-chip data and program memories, high-performance DMA controller, Buffered Time Division Multiplexing Port (BTDMP), high-throughput Host Processor Interface (HPI), and other interfaces. The subsystem can be used with off-the-shelf software provided by CEVA and its technology partners.
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
Related News
- Metanoia Licenses Cadence Tensilica ConnX 230 DSP for New SDR Platform
- Elliptic Labs’ AI Platform Now Optimized for Ceva’s NeuPro-Nano NPU – Enabling Smarter Edge Devices
- Sharp Microelectronics Announces Two ARM9 Reference Designs for Portable Media Players
- CEVA Partners With TES Electronic Solutions to Bring Graphics Capabilities to MM2000 Portable Multimedia Solution
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost