Broadcom CEO: Life After LTE, 5G Cellular Exit
LAS VEGAS — If you had to guess one product category conspicuously absent from Broadcom's CES booth this year, would you name smartphones?
If you did, you were right.
The Irvine, Calif.-based chip giant, who couldn’t hack its way into the global baseband modem market, decided to bag it all together last year. The smartphone modem market, locked up by Qualcomm for years, is now under fresh attack by a number of “must-win-at-all-cost” chip companies in Asia, according to Scott McGregor, CEO of Broadcom.
Noting that his company was losing about $2 million a day in the modem business, McGregor, who looked almost relieved, proudly pointed to the Broadcom booth and bragged, “We have no cell phones.”
The company’s focus is now on the broadband and connectivity businesses. “Our broadband is an extremely strong and valuable business. Our connectivity business is also very strong, and is focused more on the Internet of Things now,” he said. “Frankly, these are better businesses to be in and invest in.”
The company is broadening its technology and businesses. These include connected homes, and more recently, automotive. McGregor called the automotive segment “a great business we are sort of tiptoeing into” and finding it “very interesting.”
EE Times caught up with McGregor last week during CES and asked him how the company's decision to not participate in the baseband business is likely to affect Broadcom in the future. Here’s an excerpt of our conversation.
To read the full article, click here
Related Semiconductor IP
- Post-Quantum Digital Signature IP Core
- Compact Embedded RISC-V Processor
- Power-OK Monitor
- RISC-V-Based, Open Source AI Accelerator for the Edge
- Securyzr™ neo Core Platform
Related News
- CEO interview: S3 Semi ready for custom opportunity
- CEO interview: Flex Logix' Geoff Tate on licensing FPGA
- CEO interview: The importance of being agile
- CEO interview: Globalfoundries' Tom Caulfield on the European project
Latest News
- Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions
- ChipAgents Raises Oversubscribed $21M Series A to Redefine AI for Chip Design
- Zero ASIC announces release of Platypus heterogeneous eFPGA
- Arteris Selected by 2V Systems for IO Chiplet for Data Center
- Ceva Introduces Wi-Fi 7 1x1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems