ARM and Cadence Collaborate to Optimize ARM POP Solutions with Cadence Encounter Digital Platform
Latest Milestone Provides Performance and Power Advantages for ARM Cortex-A9 and Cortex-A15 Processors
CAMBRIDGE, UK and SAN JOSE, Calif., 08 Aug 2012 -- ARM and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the first in a series of combined solutions enabling designers to improve performance, power and time-to-market for ARM® CortexTM-A series processor-based system-on-chips (SoCs). The initial solution optimizes ARM® POP⢠IP technology, using the Cadence® Encounter® digital platform, for the Cortex-A9 processor on the TSMC 40LP process, including uLVT. The resulting solution is available for license from ARM to accelerate the implementation of ARM processors.
POP intellectual property (IP) is comprised of core-hardening acceleration technology which incorporates the latest ARM Artisan® advanced physical IP to achieve industry-leading power, performance and area (PPA) metrics. In the combined solution, the POP IP is tightly coupled to Cadence Encounter RTL-to-GDSII technologies, including RTL Compiler-Physical and the breakthrough clock concurrent optimization (CCOpt) design technology, resulting in market-leading, certified benchmarks for Cortex-A9 implementations using POP IP.
This is the latest milestone in the companiesâ longstanding collaboration to enable their mutual customers to more efficiently design advanced SoCs. ARM is working closely with the Cadence R&D and Design Services organizations prior to the introduction of new POP IP to ensure that customers benefit from the quickest deployment of new ARM processors and/or new process technologies. Extending to TSMC 28HPM, the ARM-Cadence collaboration includes single, dual and quad-core implementations of Cortex-A9 and Cortex-A15 processors.
âAs customers face ever-increasing pressure to achieve specific power and performance numbers, our early engagement with Cadence helps ensure that customers choosing our POP IP solutions can achieve higher performance at a lower power than previously available,â said Dr. John Heinlein, vice president of marketing, Physical IP Division, ARM. âThe extensive implementation knowledge and comprehensive set of benchmarking results that ARM provides in POP technology, combined with a silicon-proven Cadence methodology, also enables customers to dramatically improve their time-to-market.â
POP solutions are comprised of three critical elements necessary to achieve an optimized ARM processor implementation. First, it contains Artisan physical IP standard cell logic and memory cache instances that are specifically tuned for a given ARM processor and foundry technology. Second, it includes a comprehensive benchmarking report to document the exact conditions and results ARM achieved for the processor implementation across an envelope of configuration and design targets. Finally, it includes the detailed implementation knowledge including floor plans, scripts, design utilities and a POP Implementation Guide, which enables the end customer to achieve similar results quickly and with lower risk.
The Cadence Encounter RTL-to-GDSII flow helps design teams optimize power, performance, and area for the worldâs most advanced high-performance, energy-efficient ARM processor-based designs. The integrated Cadence flow includes Encounter RTL Compiler, Encounter Digital Implementation System, and signoff-proven Cadence QRC Extraction, and Encounter Timing System. In addition, the CCOpt technology unifies clock tree synthesis with logic/physical optimization resulting in significant power, performance and area improvements.
âWorking closely with the ARM engineering team, we have been able to deliver industry-leading performance, power and area for advanced ARM-processor implementations,â said Dr. Chi-Ping Hsu, senior vice president, Silicon Realization Group at Cadence. âThe result of this combined effort enables customers to deliver the highest quality of silicon while meeting aggressive time-to-market goals.â
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
About ARM
ARM designs the technology that is at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARMâs comprehensive product offering includes RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the companyâs broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency
- Cadence Digital and Custom/Analog Design Flows Certified for TSMC's Latest N3E and N2 Process Technologies
- Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry's SF2 and SF3 Process Technologies
- Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack