QualCore Logic successfully validated various Analog IP cores and Special IO's
Sunnyvale, Calif. --November 10, 2009 - QualCore Logic, a leading provider of digital, mixed-signal and analog intellectual property (IP) for system-on-chip (SoC) designs, today announced that it successfully validated various Analog IP cores and Special IO's for US based company - the leading providers of high performance non-volatile solid state drives.
Analog IP cores include Band gap references, Regulators, PLLs and DLLs. Special IOs cover a range of IPs that include SSTL, LVCMOS, SSTL-LVCMOS Combo, MMC, XTAL etc.The IP's are proved in TSMC 90nm and CSM 130nm technologies.
For more details, visit the QualCore Logic website located at: http://www.qualcorelogic.com/.
About QualCore Logic
Founded in 1994, QualCore Logic is a leading provider of digital, mixed-signal and analog intellectual property (IP) for system-on-chip (SoC) designs. It can take an engineering or register transfer level (RTL) specification to GDSII through final silicon. It operates design and support centers in Sunnyvale, Calif., and Hyderabad, India, with more than 200 design engineers. Web Site: http://www.qualcorelogic.com/
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- PCI-SIG Completes I/O Virtualization Suite of Specifications
- Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- intoPIX JPEG XS Cores Power Delta Video’s IP Video Transmission Solutions
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack