T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces 2024-04-22 05:23:00 Other
Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows 2024-04-19 17:22:00 EDA
GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers 2024-04-19 15:43:00 Other
DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core 2024-04-19 09:08:00 IP
Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management 2024-04-18 16:52:00 EDA
Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain 2024-04-18 16:48:00 Other
Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances 2024-04-18 16:48:00 EDA
Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins 2024-04-18 16:12:00 EDA
JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies 2024-04-17 15:27:00 Other
Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results 2024-04-17 15:13:00 Financial
U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight 2024-04-17 15:01:00 Commentary / Analysis
Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced 2024-04-17 12:39:00 IP
Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets 2024-04-17 08:07:00 Business