Dolphin Integration Joins GlobalFoundries FDXcelerator Program to Provide Breakthrough Fabric IP 2017-10-16 14:57:00 Strategic Partnerships
Thalia DA attracts fresh investment as semiconductor industry recognizes analog IP reuse challenge 2017-10-16 13:51:00 Strategic Partnerships
Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017 2017-10-16 13:41:00 Misc
Dr. Haijun Zhao, Dr. Liang Mong Song Appointed as SMIC Co-CEO and Executive Director 2017-10-16 11:49:00 People & Leadership
Codasip Hires IP Industry Veteran Chris Jones as Vice President of Marketing 2017-10-16 09:02:00 People & Leadership
Xilinx Selected by Alibaba Cloud for Next-Gen FPGA Cloud Acceleration 2017-10-13 11:25:00 SoC Architecture & Assembly
Intel FPGAs Power Acceleration-as-a-Service for Alibaba Cloud 2017-10-13 11:21:00 SoC Architecture & Assembly
Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX Process Technology 2017-10-13 05:50:00 EDA & Design Tools
Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14 ASIC Platform for Data Center and Enterprise 2017-10-12 15:14:00 IP Cores & Design
Imec and Analog Devices sign strategic research partnership for development of next-generation IoT devices 2017-10-12 13:16:00 Strategic Partnerships
Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform 2017-10-12 13:12:00 Commercial Deals
S3 Semiconductors selected to advance Satellite Transceiver Technology in ESA ARTES Partner Programme 2017-10-12 12:42:00 Strategic Partnerships
Gartner Says Worldwide Semiconductor Revenue to Reach $411 Billion in 2017 2017-10-12 10:36:00 Analysis & Insight
New MIPI Alliance Group Collaborates with Automotive Industry Experts to Address Interface Specifications for Automotive Applications 2017-10-12 03:40:00 Misc
GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow's Connected Car 2017-10-12 03:18:00 Foundries & Process Nodes
QuickLogic Partners with AcconSys to Expand eFPGA Design Activity in China 2017-10-11 13:10:00 Strategic Partnerships
Cadence Achieves TUV SUD's First Comprehensive "Fit for Purpose - TCL1" Certification in Support of Automotive ISO 26262 Standard 2017-10-11 13:04:00 EDA & Design Tools