Crypto Bugs in IEEE Standard Expose Intellectual Property in Plaintext 2017-11-06 17:34:00 Analysis & Insight
HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor 2017-11-06 17:00:00 Commercial Deals
Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at $130 Billion 2017-11-06 14:21:00 Strategic Partnerships
Flex Logix Names Fan Mo Technical Director Of FPGA CAD Software Development 2017-11-06 10:08:00 People & Leadership
Synopsys to Enhance Software Integrity Platform with Acquisition of Black Duck Software 2017-11-03 13:26:00 Strategic Partnerships
Xilinx Announces Intention to Invest $40M in Expansion of Research, Development, and Engineering Operations at EMEA Headquarters in Ireland 2017-11-03 13:20:00 Strategic Partnerships
Hardent Delivers Interoperable VESA DSC IP Solution for the New Arm Mali-D71 Processor 2017-11-02 13:18:00 IP Cores & Design
Mercury Systems Announces Safety Certifiable Graphics for Xilinx Zynq UltraScale+ MPSoC 2017-11-02 09:04:00 SoC Architecture & Assembly
Cadence to Expand High-Speed Communications IP Portfolio with Acquisition of nusemi inc 2017-11-02 08:53:00 Strategic Partnerships
UltraSoC embedded analytics selected by ELVEES for video, security and safety applications across ARM and MIPS platforms 2017-11-02 08:48:00 Commercial Deals
Synopsys Accelerates FIPS 140-2 Certification with NIST-Validated Cryptography IP Software Library 2017-11-02 08:45:00 IP Cores & Design
Cadence Joules RTL Power Solution Enables Socionext to Accelerate Low-Power HEVC 4K/60p Video Codec Chip Development 2017-11-02 02:34:00 EDA & Design Tools
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC China OIP Ecosystem Forum in Shenzhen 2017-11-02 02:14:00 Misc