Intrinsic ID Names Alpesh Saraiya as Senior Director Product Management 2017-11-29 16:06:00 People & Leadership
Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology 2017-11-29 10:22:00 Foundries & Process Nodes
Esperanto Technologies Plans Energy-Efficient Chips for Artificial Intelligence and Machine Learning, based on the open RISC-V standard 2017-11-29 10:14:00 SoC Architecture & Assembly
Western Digital To Accelerate The Future Of Next-Generation Computing Architectures For Big Data And Fast Data Environments 2017-11-29 09:44:00 Strategic Partnerships
SiFive Joins FDXcelerator Program to Bring RISC-V Core IP to GLOBALFOUNDRIES' 22FDX Process Technology 2017-11-29 09:22:00 Strategic Partnerships
Cadence Announces Availability of Industry's First PCI Express 5.0 Verification IP 2017-11-29 08:59:00 Verification IP
Minima Processor Reduces SoC Energy Consumption for Near-Threshold Voltage Design 2017-11-28 21:01:00 IP Cores & Design
Amazon Web Services Names Intrinsic ID Advanced Tier Technology Partner in AWS Partner Network 2017-11-28 15:55:00 Strategic Partnerships
Inside Secure Selected by Neopost to Protect Online Postage Transactions 2017-11-28 08:47:00 Commercial Deals
Titan IC launches "Hyperion F1 10G RegEx File Scan" on AWS Marketplace 2017-11-28 08:27:00 IP Cores & Design
Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Grenoble 2017 2017-11-28 02:45:00 Misc
SiFive and Microsemi Expand Relationship with Strategic Roadmap Alignment and a Linux-Capable, RISC-V Development Board 2017-11-28 02:43:00 Strategic Partnerships
Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents 2017-11-27 16:34:00 Legal & IP Strategy
Intrinsix Cryptographic IP Selected by DARPA for Use in Chips Program, Featuring RISC-V Security Processor 2017-11-27 15:17:00 Commercial Deals
TTTech collaborates with Intel to develop FPGA-based TSN solution for Industrial Automation 2017-11-27 13:38:00 IP Cores & Design
EnSilica's RADAR Imaging Co-processor addresses problem of automotive data overload to accelerate development of self-drive cars 2017-11-27 12:49:00 IP Cores & Design
Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA 2017-11-27 12:23:00 IP Cores & Design