ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment 2019-05-01 18:10:00 SoC Architecture & Assembly
Comcores and DENSO AUTOMOTIVE Deutschland GmbH test TSN Ethernet for Automotive Applications in the Research Project EMPHASE 2019-05-01 16:02:00 Commercial Deals
Synopsys Announces Industry's First DDR5 NVDIMM-P Verification IP for Next-generation Storage-class Memory Designs 2019-05-01 15:47:00 Verification IP
Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores 2019-05-01 15:44:00 EDA & Design Tools
Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology 2019-05-01 15:28:00 IP Cores & Design
Synopsys Launches New VESA DSC IP for Visually Lossless Compression in Mobile, AR-VR, and Automotive SoCs 2019-04-30 15:13:00 IP Cores & Design
Global Semiconductor Sales Down 15.5 Percent in First Quarter of 2019 2019-04-30 13:41:00 Analysis & Insight
Multiple Arteris IP FlexNoC Interconnect Licenses Purchased by VeriSilicon for Multiple Chip Designs 2019-04-30 13:30:00 Commercial Deals
GOWIN Adopts HyperBus for built-in PSRAM and HyperRAM Interfacing 2019-04-30 09:18:00 SoC Architecture & Assembly
Moortec To Showcase Its PVT Monitoring IP At TSMC 2019 Boston Technology Workshop 2019-04-30 01:52:00 Misc
Arm announces appointment of Inder Singh as Chief Financial Officer 2019-04-29 16:21:00 People & Leadership
Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017 2019-04-29 15:55:00 Analysis & Insight
SiFive Announces Strategic Partnership with QuickLogic and Launches SoC Templates for Rapid Chip Design 2019-04-29 09:26:00 Strategic Partnerships
TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement 2019-04-26 11:29:00 Foundries & Process Nodes