INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash
2019-05-20 10:46:00
Commercial Deals
Chiplet News Archive - Page 435 of 1945
Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market
2019-05-20 02:45:00
EDA & Design Tools
Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank
2019-05-17 12:11:00
Strategic Partnerships
Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung
2019-05-17 10:41:00
Analysis & Insight
lowRISC Expands and Appoints New Members to the Board of Directors from Google and ETH Zurich
2019-05-17 10:27:00
People & Leadership
SmartDV Reduces Protocol Debug Time with Smart ViPDebug
2019-05-16 16:13:00
EDA & Design Tools
Making virtual more of a reality with the new Arm Mali-D77 display processor
2019-05-15 19:32:00
IP Cores & Design
New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets
2019-05-15 17:12:00
IP Cores & Design
Arm demonstrates new IoT test chip and board for highly efficient, secure IoT designs
2019-05-15 14:05:00
SoC Architecture & Assembly
Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
2019-05-15 13:30:00
Foundries & Process Nodes
AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor
2019-05-15 13:21:00
SoC Architecture & Assembly
eSilicon Announces Production Qualification of 5G Infrastructure ASIC
2019-05-15 11:03:00
IP Cores & Design
Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies
2019-05-15 10:59:00
IP Cores & Design
Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology
2019-05-15 10:54:00
IP Cores & Design
Silicon Labs Partners with Pulsic, Selecting Animate as Its Automated Layout Solution for Analog IC Designs
2019-05-15 01:28:00
EDA & Design Tools
Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS
2019-05-14 13:26:00
Commercial Deals
Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
2019-05-14 12:57:00
EDA & Design Tools
EDA Vendors Spread Wings as Market Softens
2019-05-14 12:53:00
Analysis & Insight
Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program
2019-05-14 12:42:00
IP Cores & Design
Tiempo Secure Joins Deutsche Telekom's nuSIM Partnering Network
2019-05-14 07:16:00
Misc