Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology
Moortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP).
May 1, 2019 -- As market leaders, Moortec supported integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge infrastructure, powered by Arm Neoverse solutions. The Neoverse N1 SDP is the industry’s first 7nm infrastructure-specific system development platform, enabling asymmetrical compute acceleration through the CCIX interconnect architecture. The collaboration between Moortec and Arm achieved a solution capable of dynamically sensing in-chip conditions to help optimize power consumption, maximize system speed, and enhance device reliability. The Neoverse N1 SDP is available to hardware and software developers for hardware prototyping, software development, system validation, and performance profiling/tuning.
“Arm Neoverse solutions are designed to deliver the performance and efficiency required to enable the cloud-to-edge infrastructure for a world with a trillion connected devices,” said Mohamed Awad, vice president of marketing, Infrastructure Line of Business, Arm. “Our collaboration with Moortec on the N1 SDP test chip demonstrates how another piece of validated IP fits within the Neoverse platform, accelerating development and adoption of Arm-based solutions across the infrastructure.”
“Through our collaboration, we are helping to enhance performance and efficiency of Arm’s next-generation compute technology on 7nm. By contributing our high accuracy embedded sensing fabric to the development of the Neoverse N1 SDP, we’re enabling customers to benefit from higher performance and reliability within machine learning, artificial intelligence and data analytics applications,“ said Moortec CEO, Stephen Crosher.
About Moortec
Established in 2005 Moortec provides compelling embedded sub-system IP solutions for monitoring, targeting advanced node CMOS technologies from 40nm down to 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimization and power management control systems.
Visit http://www.moortec.com.
Related Semiconductor IP
- Compact Embedded RISC-V Processor
- Embedded USB2 (eUSB) Controller + PHY IP
- Embedded Hardware Security Module (Root of Trust) - Automotive Grade ISO 26262 ASIL-B
- Embedded Hardware Security Module for Automotive and Advanced Applications
- Embedded AI accelerator IP
Related News
- Moortec to show off its advances in PVT monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ARM TechCon in San Jose
- Moortec's 7nm In-Chip Monitoring Subsystem IP chosen by Esperanto Technologies to optimise performance and reliability in its high-performance AI Chip
- Moortec to showcase its advances in PVT in-chip monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ICCAD in Zhuhai China
- The Growing Need for On-Chip PVT Die Monitoring Solutions
Latest News
- Marvell Completes Acquisition of Celestial AI
- IntoPIX Showcases Next‑Gen IPMX & JPEG XS Innovations At ISE 2026
- NanoIC extends its PDK portfolio with first A14 logic and eDRAM memory PDK
- Qualitas Semiconductor Secures Strategic IP Licensing Agreement for MIPI Solutions
- Chinese RISC-V Chipmaker SpacemiT Launches K3 AI CPU, Highlighting the Rise of Open-Source Hardware in Intelligent Computing