PUFsecurity Unveils PUFiot, PUF-based Secure Crypto Coprocessor
2020-09-01 07:53:00
IP Cores & Design
Chiplet News Archive - Page 356 of 1945
Kneron's Next-Gen AI SoC Processes Video and Audio at the Edge
2020-08-31 16:30:00
Analysis & Insight
Broadcom Overtakes Qualcomm for First Place While Nvidia Scores Highest YoY Growth in 2Q20 Revenue Ranking of Global Top Ten IC Design Companies, Says TrendForce
2020-08-31 13:36:00
Analysis & Insight
Mobiveil's 25xN RapidIO 4.1 compliant controller IP achives production status
2020-08-31 09:53:00
IP Cores & Design
Flex Logix Announces nnMAX AI Inference IP In Development On GLOBALFOUNDRIES 12LP Platform
2020-08-31 06:20:00
IP Cores & Design
MIPS lands up in China
2020-08-27 16:33:00
Analysis & Insight
Chips&Media Publicizes the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit
2020-08-27 16:26:00
Strategic Partnerships
Chelsio Adopts Synopsys DesignWare 56G Ethernet PHY IP to Accelerate Development of High-Performance Computing SoC
2020-08-27 15:13:00
Commercial Deals
proteanTecs Closes $45M Growth Equity Round Led by Koch Disruptive Technologies (KDT)
2020-08-27 14:40:00
Strategic Partnerships
Mentor's Questa and Veloce platforms help SimpleMachines dramatically speed development of its first AI processor
2020-08-27 13:10:00
EDA & Design Tools
China chip imports still at $300bn
2020-08-27 12:58:00
Analysis & Insight
Bluespec, Inc. Releases RISC-V Explorer: A Fast, Free, Accurate Way to Evaluate RISC-V
2020-08-27 07:41:00
SoC Architecture & Assembly
SiliconArts Joins the Khronos Group to Support Standardization of Vulkan Ray Tracing
2020-08-27 06:55:00
Misc
Nvidia Data Center Growth: Could Buying Arm Be an Ideal Match?
2020-08-26 08:11:00
Analysis & Insight
Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions
2020-08-26 04:58:00
EDA & Design Tools
Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology
2020-08-25 16:32:00
Foundries & Process Nodes
TSMC Plots the Process Course to Its Next "Generational Node"
2020-08-25 15:21:00
Analysis & Insight
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows
2020-08-25 15:10:00
EDA & Design Tools
Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design
2020-08-25 15:07:00
EDA & Design Tools
Huawei is hurrying to build a wafer fab
2020-08-25 12:42:00
Analysis & Insight