TSMC Plots the Process Course to Its Next "Generational Node"
By Brian Santo, EETimes (August 25, 2020)
Even as it ramps up production on its N5 process, Taiwan Semiconductor Manufacturing Co. (TSMC), at its annual Technology Symposium, introduced its N4 process, which it said is scheduled to come online in late 2021, with volume production in 2022. Anticipating the inevitable question, the company also provided some details about its subsequent N3.
Before getting into the intermediate future, TSMC offered some near-future news. The company revealed a plan to implement an enhanced version of N5, called N5P, in 2021. The N5 refinement will provide an additional 5 percent speed gain and 10 percent power improvement over N5, TSMC said.
N4, the company promised at its annual Technology Symposium, will be a “straightforward migration” from, and an extension of, N5, of course with some performance, power and density enhancements. On the production side, TSMC said it will be able to reduce the number of mask layers somewhat. On the design side, the company said it will have design rules, SPICE and IP compatible with N5.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election
- After TSMC fab in Japan, advanced packaging facility is next
- eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes
- 4Q24 Global Top 10 Foundries Set New Revenue Record, TSMC Leads in Advanced Process Nodes, Says TrendForce
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack