ARM-based Server Penetration Rate to Reach 22% by 2025 with Cloud Data Centers Leading the Way, Says TrendForce 2022-03-29 14:23:00 Analysis & Insight
Edgewater Wireless selects CMC Microsystems as fabrication services Partner 2022-03-29 12:20:00 Strategic Partnerships
Advancing VHDL's Verification Capabilities with VHDL-2019 Protected Types 2022-03-29 08:09:00 EDA & Design Tools
Gidel FPGA boards used for next generation wireless communication research 2022-03-28 16:22:00 SoC Architecture & Assembly
MIPS Chooses Ashling's RiscFree Toolchain for its RISC-V ISA Compatible IP Cores 2022-03-28 15:23:00 SoC Architecture & Assembly
AI Chip Company Syntiant Raises $55 Million to Accelerate Growth 2022-03-28 15:03:00 Strategic Partnerships
Samsung retains top spot in Omdia Q4 2021 semiconductor market analysis 2022-03-28 13:50:00 Analysis & Insight
Introducing DDR5/DDR4/LPDDR5 Combo PHY IP Core, Silicon Proven in 12FFC for Next-Gen High performance SoCs is available for immediate licensing 2022-03-28 13:23:00 IP Cores & Design
Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services 2022-03-24 16:40:00 EDA & Design Tools
The Semiwise's Flat Field Transistor enables the continuation of DRAM scaling 2022-03-24 16:40:00 EDA & Design Tools
Amid Rising Volume and Pricing, Top 10 IC Design Companies Post 2021 Revenue Topping US$100 Billion 2022-03-24 16:40:00 Analysis & Insight
CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale 2022-03-24 16:39:00 Misc