Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology
2022-03-16 13:21:00
EDA & Design Tools
Chiplet News Archive - Page 254 of 1945
2022 Flash Memory CapEx Expected to Reach $29.9B; Set New High
2022-03-16 13:02:00
Analysis & Insight
PCIe 6.0 Designed to Meet Automotive, AI Bandwidth Demands
2022-03-15 15:20:00
Analysis & Insight
Weebit scaling down its ReRAM technology to 22nm
2022-03-15 13:22:00
IP Cores & Design
SEGGER announces that Renesas has licensed emWin for all RX microcontrollers
2022-03-14 13:39:00
SoC Architecture & Assembly
IAR Systems extends powerful RISC-V solutions with 64-bit support
2022-03-14 13:32:00
SoC Architecture & Assembly
Rambus Announces James Mitarotonda to Become Board Advisor
2022-03-14 12:10:00
People & Leadership
Alphawave IP Announces Definitive Agreement to Acquire Entire OpenFive Business Unit from SiFive for US$210m in cash
2022-03-14 08:15:00
Strategic Partnerships
HDMI 2.0 Tx PHY in 12FFC along with Controller IP Core with high lossless Audio/Video data transfer, licensed for a 4KTV SoC
2022-03-14 01:16:00
Misc
Imagination and Realtek launch world-first image compression DTV SoC
2022-03-10 16:40:00
IP Cores & Design
SEGGER collaborates with HPMicro making Embedded Studio for RISC-V available at no cost
2022-03-10 16:39:00
SoC Architecture & Assembly
AlphaICs welcomes IEEE Fellow Michael Shebanow as Chief Technology Officer
2022-03-10 16:38:00
People & Leadership
QuickLogic Announces a New Approximately $1M eFPGA Contract
2022-03-10 16:38:00
Commercial Deals
Zepp Health signs licence agreement for sureCore's EverOn ultra-low voltage memory IP
2022-03-10 16:37:00
Commercial Deals
PragmatIC Semiconductor leads project to digitise reusable packaging
2022-03-10 16:37:00
Misc
QuantWare releases 25-qubit Contralto QPU
2022-03-10 16:37:00
SoC Architecture & Assembly
TSMC February 2022 Revenue Report
2022-03-10 16:37:00
Financials
Codasip University Program spurs innovation and boosts curriculums
2022-03-10 12:23:00
Misc
OPENEDGES Announces Silicon Proven 12nm LPDDR54 PHY IP
2022-03-10 10:55:00
IP Cores & Design
GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs
2022-03-10 07:13:00
IP Cores & Design