PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready 2022-09-27 07:58:00 IP Cores & Design
Chips&Media Expands to New Markets such as Autonomous Vehicles 2022-09-27 07:49:00 Strategic Partnerships
Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo 2022-09-27 06:12:00 SoC Architecture & Assembly
Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware 2022-09-27 05:29:00 SoC Architecture & Assembly
Arm announces new Board Members and new Chief Financial Officer 2022-09-27 05:21:00 People & Leadership
SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors 2022-09-27 04:33:00 IP Cores & Design
U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification 2022-09-27 02:24:00 Foundries & Process Nodes
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution 2022-09-26 15:14:00 EDA & Design Tools
GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V 2022-09-26 13:28:00 SoC Architecture & Assembly
QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer 2022-09-26 08:35:00 Strategic Partnerships
HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights) 2022-09-26 01:07:00 Misc
Bosch plans acquisition of Radio Frequency specialist ItoM 2022-09-23 17:18:00 Strategic Partnerships
Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market 2022-09-23 13:39:00 SoC Architecture & Assembly
CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space 2022-09-23 10:53:00 Commercial Deals
Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October 2022-09-22 16:55:00 Misc
Flex Logix Selects Semifore for Advanced Inference Chip Design 2022-09-22 16:55:00 EDA & Design Tools
Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks 2022-09-22 16:55:00 Misc
Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow 2022-09-22 16:54:00 EDA & Design Tools