Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October
September 22, 2022 -- Vidatronic will be exhibiting at the Samsung Foundry Forum and SAFE™ Forum in San Jose on October 3rd and 4th. If you are attending the event, make sure you visit Vidatronic’s booth to learn more about how our company addresses several challenges of semiconductor design in the connected world by providing power management, analog, and security intellectual property (IP) licenses and platform solutions for integration into customers’ systems-on-a-chip (SoCs).
If you are not able to attend in-person, Vidatronic’s Vice President of Sales and Business Development, Stephen Nolan, will be discussing the future of power management and analog design in a presentation available online for the virtual portion of the event.
The Vidatronic team will be available to chat at the booth during the event and looks forward to speaking to attendees and customers. They will also be available to contact through the Samsung SAFE™ virtual event site.
For more information or to register, please visit the event page.
https://semiconductor.samsung.com/us/event/foundry-events-2022-us/
Related Semiconductor IP
- xSPI Master IP | NOR IP
- xSPI - PSRAM Master
- VESA VDC-M Encoder IP
- VESA DSC V1.2 Encoder
- VESA DSC V1.2 Decoder
Related News
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
- Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th
- Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023
- Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale