Flex Logix Unveils First AI Integrated Mini-ITX System to Simplify Edge and Embedded AI Deployment
2022-09-13 06:44:00
SoC Architecture & Assembly
Chiplet News Archive - Page 219 of 1945
Global IP Core Announces the Availability of The WiMAX IEEE802.16e Modem and FEC IP Core For Licensing and Integration
2022-09-13 05:54:00
IP Cores & Design
Rambus Initiates Accelerated Share Repurchase Program
2022-09-12 15:12:00
Strategic Partnerships
Expanded Partnership Between Arteris and Arm to Accelerate Automotive Electronics
2022-09-12 15:05:00
Strategic Partnerships
ARM, IBM team on low power analog AI chip
2022-09-12 12:59:00
Analysis & Insight
Cortus Announces the Launch of its New Secure Low Power RISC-V Microcontrollers
2022-09-12 11:48:00
IP Cores & Design
SoC.one and Imagination Technologies Partner to Enable Adoption of RISC-V for Automotive Design
2022-09-12 11:43:00
Strategic Partnerships
Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control
2022-09-12 02:22:00
SoC Architecture & Assembly
1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available for immediate licensing
2022-09-12 01:00:00
Misc
Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP
2022-09-09 16:37:00
Commercial Deals
Fraunhofer IIS and Astrodesign cooperate to offer JPEG XS solutions for video equipment manufacturer
2022-09-09 13:22:00
Strategic Partnerships
OPENEDGES Listing on KOSDAQ this September
2022-09-09 12:24:00
Strategic Partnerships
Brite Semiconductor Provides USB IP Total Solution
2022-09-09 08:36:00
IP Cores & Design
Flex Logix's Barrie Mullins To present at the 2022 AI Hardware Summit
2022-09-09 06:46:00
Misc
intoPIX SDKs rev up performance to meet the rapidly increasing encoding and decoding demand of Software-based Production & Pro-AV
2022-09-09 06:27:00
SoC Architecture & Assembly
SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge
2022-09-08 16:55:00
Commercial Deals
Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking
2022-09-08 16:55:00
Analysis & Insight
Samsung Sounds Alarm About '22 Chip Market Landing
2022-09-08 16:54:00
Analysis & Insight
Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports
2022-09-08 16:53:00
Analysis & Insight
Fraunhofer IIS announces its JPEG XS SDK 5.0 solutions achieving 25% higher speed for en- and decoding
2022-09-08 16:53:00
SoC Architecture & Assembly