U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification 2022-09-27 04:24:00 Foundries
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution 2022-09-26 17:14:00 EDA
QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer 2022-09-26 10:35:00 Business
HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights) 2022-09-26 03:07:00 Other
Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market 2022-09-23 15:39:00 FPGA
CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space 2022-09-23 12:53:00 Deals
Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks 2022-09-22 18:55:00 Other
Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October 2022-09-22 18:55:00 Other
Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow 2022-09-22 18:54:00 EDA
CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs 2022-09-21 15:15:00 IP
Perforce Joins the Global Semiconductor Alliance and Debuts IP Maturity Model 2022-09-21 14:43:00 Other
IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades 2022-09-21 13:45:00 Chip