Imec's extremely scaled SOT-MRAM devices show record low switching energy and virtually unlimited endurance
2023-12-14 16:46:00
Other
Recent News
Amidst export restrictions, RISC-V continues to advance
2023-12-14 16:46:00
Commentary / Analysis
GigaDevice partners with SEGGER on Embedded Studio for RISC-V
2023-12-14 16:46:00
Embedded Systems
PUFsecurity and Himax Prioritize User Security and Data Protection in Endpoint AI with PUF-based Root of Trust
2023-12-14 10:11:00
Business
Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity
2023-12-14 09:10:00
IP
Xylon Offers ARTIEYE - a Complete Technology Suite for Customizable AI-based Driver Monitoring Systems
2023-12-13 16:00:00
Embedded Systems
Alchip Unveils AI 3DIC Design and IP Platform
2023-12-13 14:18:00
IP
SCALINX and Arteris Partner on Advanced Communications Innovation
2023-12-12 14:55:00
Deals
AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions
2023-12-12 14:50:00
Deals
Logic Fruit Technologies Launches CAN Controller IP Core
2023-12-12 14:01:00
IP
Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security
2023-12-12 10:34:00
IP
Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development
2023-12-12 08:19:00
Embedded Systems
Andes Awards Imperas 2023 Partner of the Year
2023-12-12 08:13:00
Business
Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance
2023-12-12 08:07:00
Other
Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges
2023-12-12 08:01:00
Other
China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce
2023-12-11 14:15:00
Commentary / Analysis
EnSilica enters strategic partners with design and custom module developer IndesmaTech
2023-12-11 13:34:00
Business
NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM
2023-12-11 10:06:00
EDA
12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing
2023-12-11 07:39:00
Other
TSMC November 2023 Revenue Report
2023-12-08 16:04:00
Financial
Amidst export restrictions, RISC-V continues to advance
2023-12-14 16:46:00
Commentary / Analysis
GigaDevice partners with SEGGER on Embedded Studio for RISC-V
2023-12-14 16:46:00
Embedded Systems
PUFsecurity and Himax Prioritize User Security and Data Protection in Endpoint AI with PUF-based Root of Trust
2023-12-14 10:11:00
Business
Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity
2023-12-14 09:10:00
IP
Xylon Offers ARTIEYE - a Complete Technology Suite for Customizable AI-based Driver Monitoring Systems
2023-12-13 16:00:00
Embedded Systems
Alchip Unveils AI 3DIC Design and IP Platform
2023-12-13 14:18:00
IP
SCALINX and Arteris Partner on Advanced Communications Innovation
2023-12-12 14:55:00
Deals
AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions
2023-12-12 14:50:00
Deals
Logic Fruit Technologies Launches CAN Controller IP Core
2023-12-12 14:01:00
IP
Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security
2023-12-12 10:34:00
IP
Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development
2023-12-12 08:19:00
Embedded Systems
Andes Awards Imperas 2023 Partner of the Year
2023-12-12 08:13:00
Business
Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance
2023-12-12 08:07:00
Other
Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges
2023-12-12 08:01:00
Other
China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce
2023-12-11 14:15:00
Commentary / Analysis
EnSilica enters strategic partners with design and custom module developer IndesmaTech
2023-12-11 13:34:00
Business
NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM
2023-12-11 10:06:00
EDA
12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing
2023-12-11 07:39:00
Other
TSMC November 2023 Revenue Report
2023-12-08 16:04:00
Financial