Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications
2024-08-13 06:03:00
Misc
Chiplet News Archive - Page 97 of 1944
Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design
2024-08-12 15:53:00
Misc
Linux Foundation Welcomes the Open Model Initiative to Promote Openly Licensed AI Models
2024-08-12 15:26:00
Misc
AMD Completes Acquisition of Silo AI to Accelerate Development and Deployment of AI Models on AMD Hardware
2024-08-12 15:23:00
Strategic Partnerships
Rupert Baines joins Nanusens board
2024-08-12 12:08:00
People & Leadership
Fraunhofer IPMS remains important research partner for GlobalFoundries Dresden
2024-08-12 10:53:00
Misc
TSMC July 2024 Revenue Report
2024-08-12 09:54:00
Financials
Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company
2024-08-12 08:28:00
Commercial Deals
Secure-IC signs International Collaboration with Taiwan Quantum Safe Association and PQC-CIA
2024-08-12 07:41:00
Misc
SMIC Reports 2024 Second Quarter Results
2024-08-12 01:58:00
Financials
16-Bit, 5MSPS SAR ADC IP Core Silicon-Proven: Delivers Superior Dynamic Performance with Flexible Resolution Modes for Next-Generation Applications
2024-08-12 01:00:00
Misc
Ceva, Inc. Announces Second Quarter 2024 Financial Results
2024-08-07 13:28:00
Financials
NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage
2024-08-07 08:50:00
Misc
ZeroPoint Technologies introduces zstd Decompression Hardware IP
2024-08-07 08:08:00
IP Cores & Design
UMC Reports Sales for July 2024
2024-08-07 01:53:00
Financials
Consult Red Announces Strategic Partnership with CAST, Inc.
2024-08-06 15:33:00
Strategic Partnerships
ZeroPoint Technologies introduces LZ4 Compression and Decompression Hardware IP
2024-08-05 18:45:00
IP Cores & Design
Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5%
2024-08-05 16:06:00
Analysis & Insight
NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
2024-08-05 15:31:00
SoC Architecture & Assembly
Alphawave Semi Appoints Chief Accounting Officer, Sameer Ladiwala
2024-08-05 13:24:00
People & Leadership