Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP 2023-09-21 18:47:00 IP
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing 2023-09-21 18:46:00 Foundries
Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports 2023-09-21 18:46:00 Commentary / Analysis
BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology 2023-09-21 18:46:00 Business
Kalray announces the availability of its new processor "Coolidge™2", the first DPU optimized for AI and data intensive processing 2023-09-21 18:45:00 Chip
Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal 2023-09-21 18:45:00 Other
Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks 2023-09-21 16:44:00 Commentary / Analysis
AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution 2023-09-21 16:32:00 Embedded Systems
AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships 2023-09-20 18:55:00 IP
Thalia expands footprint in China with appointment of Business Partner Fionn Liu 2023-09-20 17:43:00 People
ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors 2023-09-20 14:44:00 Business
QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs 2023-09-19 17:32:00 Business
Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator 2023-09-19 17:23:00 IP