Why is NXP Moving to FD-SOI?
The latest generations of power efficient and full-featured applications processors in NXP’s very successful and broadly deployed i.MX platform are being manufactured on 28nm FD-SOI. The new i.MX 7 series leverages the 32-bit ARM v7-A core, targeting the general embedded, e-reader, medical, wearable and IoT markets, where power efficiency is paramount. The i.MX 8 series leverages the 64-bit ARM v8-A series, targeting automotive applications, especially driver information systems, as well as high-performance general embedded and advanced graphics applications.
Over 200 million i.MX SOCs have been shipped over six product generations since the i.MX line was first launched (by Freescale) in 2001. They’re in over 35 million vehicles today, are leaders in e-readers and pervasive in the general embedded space. But the landscape for the markets targeted by the i.MX 7 and i.MX 8 product lines are changing radically. While performance needs to be high, the real name of the game is power efficiency.
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Complex Digital Up Converter
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
- MIPI SWI3S Manager Core IP
Related Blogs
- Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
- GloFo's 12nm FD-SOI: why it makes headlines in China
- Why IMG CXT ray tracing is a game-changer for mobile
- Why thinking about software and security is so important right at the start of an ASIC design
Latest Blogs
- CNNs and Transformers: Decoding the Titans of AI
- How is RISC-V’s open and customizable design changing embedded systems?
- Imagination GPUs now support Vulkan 1.4 and Android 16
- From "What-If" to "What-Is": Cadence IP Validation for Silicon Platform Success
- Accelerating RTL Design with Agentic AI: A Multi-Agent LLM-Driven Approach