Does size matter? Understanding Wafer Size
Silicon wafers are the most essential element in the realization of ICs. The semiconductor industry had invested heavily to increase the wafer size during the last 30 years, so while foundries used to produce 1 inch wafers, today’s common wafer size is 300mm (118 times larger than 1 inch). There is a clear plan to move towards a 450mm wafer size (1.5 times larger than 300mm).
Increasing wafer size is not a trivial process. As a matter of fact, silicon wafer manufacturing technologies were re-engineered in order to achieve the technology necessary to increase the wafer size during the years. It is difficult to grasp the amount of capital invested in the size growth innovation. My guess is around a triple-digit Billion USD.
Related Semiconductor IP
- NPU IP Core for Mobile
- NPU IP Core for Edge
- Specialized Video Processing NPU IP
- HYPERBUS™ Memory Controller
- AV1 Video Encoder IP
Related Blogs
- TSMC Wafer Allocation and Design Migration
- What's happening on the 450mm wafer front?
- Wafer Costs: Out of Control or Not?
- Packaging and Delivery Methodology for: wafer, die and ICs
Latest Blogs
- Securing The Road Ahead: MACsec Compliant For Automotive Use
- Beyond design automation: How we manage processor IP variants with Codasip Studio
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- The Role of GPU in AI: Tech Impact & Imagination Technologies
- Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding