UCIe: Enabling the Chiplet-Based Ecosystem
Universal Chiplet Interconnect Express (UCIe) is a novel specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.
What Is a Chiplet?
A chiplet is a tiny integrated circuit (IC) with a well-defined specific functionality. One can relate this to LEGO building blocks for creating large structures.
Why Do We Need a Chiplet-Based Design?
Modern designs require high-performance computation feasible through lower nanometers (5-7nm), but still, most part of the design gives better performance with older nodes(16-28nm). The chiplet-based design approach opens opportunities to combine chiplets from different process nodes into the same package. This even results in cost reductions of specialized chips.
To read the full article, click here
Related Semiconductor IP
- UCIe PHY (Die-to-Die) IP
- UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
- UCIe D2D Adapter
- UCIe Die-to-Die Chiplet Controller
- Simulation VIP for UCIE
Related Blogs
- UCIe Heralds a Robust Chiplet Ecosystem for a New Era of SoC Innovation
- Enabling the Global 800G Ecosystem with 112G Ethernet PHY IP
- How the SiFive HiFive Premier P550 is Accelerating Linux Ecosystem Adoption
- Enabling AI Innovation at The Far Edge
Latest Blogs
- Enabling End-to-End EDA Flow on Arm-Based Compute for Infrastructure Flexibility
- Real PPA improvements from analog IC migration
- Design specification: The cornerstone of an ASIC collaboration
- The importance of ADCs in low-power electrocardiography ASICs
- VESA Adaptive-Sync V2 Operation in DisplayPort VIP