TSMC OIP: On the Road to the Silicon Super Chip
October 7, 2013
SAN JOSE, Calif.--If you're the world's largest foundry, there's no slowing down, especially if you're roaring down the road to the "silicon wafer-based silicon super chip."
That was my take-away earlier this week (Oct. 1) listening to TSMC Vice President of R&D and CTO Dr. Jack Sun during TSMC's Open Innovation Platform® (OIP) event here at Cadence headquarters.
From 20nm system-on-chip (SoC) production, to the ramp of 16nm FinFETs, to 7- and 5-nm technologies in the distant future, and R&D and capacity investments in between, the pace of innovation at the Taiwanese company seems faster than ever.
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