Could TSMC be your next chip design cloud owner?
In a 2009 technical report, ”The Clouds: A Berkeley view of cloud computing”, the authors cite “Cloud Computing is likely to have the same impact on software that foundries have had on the hardware industry”. The underlying logic being the high cost of semiconductor fabrication line leading to the rise of semiconductor fabs and these in turn “enabling” fabless semiconductor design companies whose value is in innovative chip design.
A week back, I moderated a panel discussion on cloud computing in the IC design world, especially on accelerating time to market. While issues on security – a challenge which is stacked right on top of the “barriers to entry”, were defended and discussed quite animatedly, Surprisingly, it was the “cloud ownership” aspect which evoked only some tepid responses.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related Blogs
- Delivering a Secure, Cloud-Based SoC Design Environment for Aerospace Chip Designers
- Next-Generation DDR4 and LPDDR4 IP in TSMC 16FF+ Enable 200Gb+ Data Transfers for Mobile, Cloud, and IoT Platforms
- Different By Design: Customized Processors Help Build Chip Differentiation
- Charting a Productive New Course for AI in Chip Design
Latest Blogs
- ReRAM in Automotive SoCs: When Every Nanosecond Counts
- AndeSentry – Andes’ Security Platform
- Formally verifying AVX2 rejection sampling for ML-KEM
- Integrating PQC into StrongSwan: ML-KEM integration for IPsec/IKEv2
- Breaking the Bandwidth Barrier: Enabling Celestial AI’s Photonic Fabric™ with Custom ESD IP on TSMC’s 5nm Platform