MSL and Popcorn Effect
August 16, 2012
MSL stands for Moisture Sensitivity Level. It represent the amount of time an IC can be exposed to ambient conditions and still be assembled on a PCB without being damaged.
When the antistatic bag is opened and the ICs are exposed to ambient conditions, the moisture in the air is trapped inside the device. This means that during the PCB assembly process (e.g. reflow) this moisture expands and can damage the device.
Why is this YOUR problem?
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