MIPI UniPro: Major Differentiating Features, Benefits and Verification Challenges
MIPI UniPro is a recent addition to mobile chip-to-chip interconnect technology. It’s got many useful features to meet the requirements of mobile applications. That’s perhaps why Google’s Project Ara has selected MIPI UniPro and MIPI M-PHY as its backbone interconnects.
In this blog post, we describe three differentiating features, benefits and their verification challenges. All the discussion is referenced to MIPI UniPro 1.6.
- Achieving Low power consumption through Power mode changes and hibernation
- Flexibility in chip-to-chip lane routing through Physical Lane mapping
- Enhanced QoS through CPort arbitration & Data link layer pre-emption
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- MIPI UniPro through eyes of PCI Express
- MIPI UniPro: Comprehensive Verification Checklist
- MIPI Unipro Transport Layer (L4) - An Introduction
- Technical Comparison: MIPI UniPro 1.6 vs MIPI UniPro 1.41
Latest Blogs
- Why What Where DIFI and the new version 1.3
- Accelerating PCIe Gen6 L0p Verification for AI & HPC Designs using Synopsys VIP
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs