How to Address the Top 7 JEDEC-UFS Stack Verification Challenges Using Test Suites
November 18, 2016
If you are currently using or consider using JEDEC UFS protocol in your next design you might face several verification challenges. The following blog will talk about 7 of the biggest challenges of UFS stack verification. With the fact that people are moving to reduced pin count and increased speed, an MPHY based stack has picked up momentum and provides an increased number of new applications to leverage the UFS stack. The UFS protocol is being adopted rapidly due to its higher performance, efficiency, concurrent multi-tasking, usage of the complete band width, security, and reliability and longer power life.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- CCIX Coherency: Verification Challenges and Approaches
- Overcoming USB Type-C Verification Challenges
- Addressing the Verification Challenges of Panel Self Refresh in eDP
- Datapath Validation - Solving Verification Challenges in the Era of Artificial Intelligence and Mathematical Cores
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms