Intel Core M vs Apple A8!
There were two big announcements last week right in my backyard and I missed them both! Instead, I was in Taiwan investigating yet another big development and all three of these events will intersect next year, absolutely.
At IDF in San Francisco Intel outlined the new 14nm Core M. This is an impressive CPU, one that will fill the now half empty Intel fabs. I was even told that the shuttered fab in Arizona will be re-opened for added 14nm capacity in 2015. That is great news as there is nothing sadder than an empty $5B fab, absolutely.
Apple announced the hotly anticipated A8 (iPhone6) and was much more forthcoming with technical information than before. They certainly are proud of this SoC and if you take a close look at the specifications you will know why. It is….. wait for it….. LEGENDARY! Apple disrupts the semiconductor industry yet again!
The news out of Taiwan is the TSMC 16FF+ process, which Morris Chang said would be delayed until 2H 2015, has been pulled into 1H 2015 which puts it into reach of the coveted Apple business. Since Apple releases new iProducts in the Fall of each year the foundries have to lockstep with the rest of the Apple supply chain and deliver wafers in 1H 2015.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related Blogs
- Intel Core M vs. Pentium M
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- Intel Quark: Synthesizable Core But You Can't Have It
- TSMC vs Intel vs Samsung FinFETs
Latest Blogs
- lowRISC Tackles Post-Quantum Cryptography Challenges through Research Collaborations
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction
- The Integrated Design Challenge: Developing Chip, Software, and System in Unison
- Introducing Mi-V RV32 v4.0 Soft Processor: Enhanced RISC-V Power