What is inside the iPhone5s? Samsung or TSMC?
As a semiconductor professional and an Apple customer I’m very interested to see what is inside the iPhone5s. Rumors are spreading, photos are leaking, creating a nice build up to the next release of the mobile device that changed the world.
Honestly, last year I was a bit disappointed with the iPhone5. Inside is the A6 SoC which uses the Samsung 32nm process technology, even though Samsung announced a fully qualified 28nm process in June of 2011 (Can Samsung Deliver?). As a result, rumors swirled that Apple would switch to TSMC 28nm, rumors which I found to be false (TSMC Apple Rumors Debunked). So no, sad to say the iPhone5s will not have a TSMC 28nm SoC. My guess is that it will be Samsung 28nm which is said to be in production now.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- TSMC Tops Intel, Samsung in Capacity!
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- TSMC Responds to Samsung!
- TSMC vs Intel vs Samsung FinFETs
Latest Blogs
- The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
- Unlock early software development for custom RISC-V designs with faster simulation
- HBM4 Boosts Memory Performance for AI Training
- Using AI to Accelerate Chip Design: Dynamic, Adaptive Flows
- Locking When Emulating Xtensa LX Multi-Core on a Xilinx FPGA