TSMC Tops Intel, Samsung in Capacity!
May 14, 2012
While I was marlin fishing in Hawaii last week I missed some interesting comments from TSMC executives at the Technology Symposium in Taiwan, a much different show than the one here in San Jose I’m told. It is good to see TSMC setting the record straight and taking a little credit for what they have accomplished! I’m sorry I missed it but I know quite a few people who didn’t and they were quite impressed.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- TSMC vs Intel vs Samsung FinFETs
- The Apple Samsung TSMC Intel 14nm Mashup!
- "Cook's Law" supersedes "Moore's Law"-its impact on Apple, Samsung, TSMC & Intel
- Intel to Skip 10nm to Stay Ahead of TSMC and Samsung?
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms