TSMC Tops Intel, Samsung in Capacity!
While I was marlin fishing in Hawaii last week I missed some interesting comments from TSMC executives at the Technology Symposium in Taiwan, a much different show than the one here in San Jose I’m told. It is good to see TSMC setting the record straight and taking a little credit for what they have accomplished! I’m sorry I missed it but I know quite a few people who didn’t and they were quite impressed.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- TSMC vs Intel vs Samsung FinFETs
- The Apple Samsung TSMC Intel 14nm Mashup!
- "Cook's Law" supersedes "Moore's Law"-its impact on Apple, Samsung, TSMC & Intel
Latest Blogs
- The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
- Unlock early software development for custom RISC-V designs with faster simulation
- HBM4 Boosts Memory Performance for AI Training
- Using AI to Accelerate Chip Design: Dynamic, Adaptive Flows
- Locking When Emulating Xtensa LX Multi-Core on a Xilinx FPGA