HBM2 continues to ramp
August 3, 2017
Samsung ramps volume production of 8GB HBM2
Earlier this month, Samsung confirmed an increase in production volume of its 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) to meet growing market needs across a wide range of applications including artificial intelligence, HPC (high-performance computing), advanced graphics, network systems and enterprise servers.
Earlier this month, Samsung confirmed an increase in production volume of its 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) to meet growing market needs across a wide range of applications including artificial intelligence, HPC (high-performance computing), advanced graphics, network systems and enterprise servers.
To read the full article, click here
Related Semiconductor IP
- HBM2E and HBM2 FPGA IP
- HBM2 Controller IIP
- HBM2 Memory Controller
- HBM2/2E Memory Controller Core
- HBM2E Synthesizable Transactor
Related Blogs
- EDA Consolidation Continues
- Microsoft’s Windows Embedded Compact 7 Continues Support of ARM
- Moore's Law Continues, but Needs Help from Heterogeneous Computing
- Japan Continues Failed Semi Strategy
Latest Blogs
- MIPI: Powering the Future of Connected Devices
- ESD Protection for an High Voltage Tolerant Driver Circuit in 4nm FinFET Technology
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- Smarter SoC Design for Agile Teams and Tight Deadlines
- Automotive Reckoning: Industry Leaders Discuss the Race to Redefine Car Development