HBM2E and HBM2 FPGA IP

Overview

HBM2E and HBM2 are high-performance memory IPs that offer a combination of high memory bandwidth, low power consumption, low latency, and small form factor for Agilex™ 7 FPGA M-Series and Stratix® 10 MX FPGAs, respectively. HBM2E and HBM2 are well-suited for a variety of high-performance computing applications.

Key Features

  • HBM2E Agilex 7 FPGA M-Series
    • Integrates two stacks of HBM2E DRAM with Agilex 7 FPGA M-Series.
      •  Support for up to 32GB HBM2E in a single device
    • Dedicated hard memory controllers for each HBM2E stack, two per device.
      • Maximizes performance across all transactions
    • Up to 820 GB/s peak memory bandwidth
      • Up to 410GB/s memory bandwidth per HBM2E stack
      • 1.6x higher bandwidth vs prior generation
      • 10x more bandwidth vs DDR5, 7x more vs GDDR6
    • High-performance network-on-chip (NoC) to help achieve the highest bandwidth.
  • HBM2 Stratix 10 MX FPGA
    • Integrates two stacks of HBM2 DRAM with Stratix 10 MX FPGA.
    • Support for up to 16GB HBM2 in a single device
    • Offers up to two HBM2 interfaces.
    • Each HBM2 device can have a device density of 4GB or 8GB, based on the FPGA chosen
    • Provides up to 256GB/s bandwidth, making it ideal for high-performance computing with fast data transfer rates.

Benefits

  • High bandwidth and small form factor.
  • Maximizes performance with the hardened memory controller.
  • High-speed memory access to implement routing and security functions.

Technical Specifications

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Semiconductor IP