Advanced Fab Capacity Utilisation Tops 90%
August 17, 2009
The indicators just keep on getting better for the semiconductor industry. Fab capacity utilisation is now above 90% for all processes better than 80nm, and for all 300mm wafer processing.
To read the full article, click here
Related Semiconductor IP
- Special Purpose Low (Statistical) offset Operation Amplifier
- Rail to Rail Input and Output Operational Amplifier
- Special Purpose Low offset Operational Amplifier
- Special Purpose Low offset Operational Amplifier
- High Current, Low offset fast Operation Amplifier
Related Blogs
- Bye Bye Fab-Lite? Infineon Expands Fab Capacity.
- TSMC explains 40nm yield problems, metal-gate stacks and why 100 per cent utilisation is bad
- Netbook Chip-Set Orders To Max Out Capacity At TSMC & UMC
- Fab allocation back on the agenda
Latest Blogs
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security
- Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
- Empowering your Embedded AI with 22FDX+