Netbook Chip-Set Orders To Max Out Capacity At TSMC & UMC
August 11, 2009
According to the Commercial Times of Taiwan, both TSMC and UMC will be at 100% capacity utilisation for 65nm and 55nm processes by November, because of a flood of orders placed on them for ARM-based Netbook chips.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- Where Is The ARM-Based Netbook?
- AT&T To Launch First ARM-Based Netbook
- TSMC OIP: On the Road to the Silicon Super Chip
- UMC the Next China Chip Embargo?
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview