Bye Bye Fab-Lite? Infineon Expands Fab Capacity.
Infineon is looking at expanding its 300mm in-house fab capacity stating: 'Infineon will decide about the start and the location of a 300mm volume production during the current fiscal year,' says the company.
Why is that surprising? Well, egged on by the financial community, semi CEOs across the world have been badgered into accepting the 'fab-lite' model.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- Advanced Fab Capacity Utilisation Tops 90%
- Netbook Chip-Set Orders To Max Out Capacity At TSMC & UMC
- Fab allocation back on the agenda
- Arteris expands their approach to Networks on Chips
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms