Bye Bye Fab-Lite? Infineon Expands Fab Capacity.
Infineon is looking at expanding its 300mm in-house fab capacity stating: 'Infineon will decide about the start and the location of a 300mm volume production during the current fiscal year,' says the company.
Why is that surprising? Well, egged on by the financial community, semi CEOs across the world have been badgered into accepting the 'fab-lite' model.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related Blogs
- Advanced Fab Capacity Utilisation Tops 90%
- Netbook Chip-Set Orders To Max Out Capacity At TSMC & UMC
- Fab allocation back on the agenda
- Semiconductor Capacity Shortages 2010
Latest Blogs
- ReRAM in Automotive SoCs: When Every Nanosecond Counts
- AndeSentry – Andes’ Security Platform
- Formally verifying AVX2 rejection sampling for ML-KEM
- Integrating PQC into StrongSwan: ML-KEM integration for IPsec/IKEv2
- Breaking the Bandwidth Barrier: Enabling Celestial AI’s Photonic Fabric™ with Custom ESD IP on TSMC’s 5nm Platform