Are we on the verge of a new ASIC era? DARPA’s Nanowriter and practical e-beam lithography
The advent of gate arrays opened the gates of custom silicon for everycompany. Before that, only the really heavyweight players could afford the tools and training to create tailored ICs for their end products. The early gate arrays changed that situation by lowering costs to the point where custom silicon made sense in far more system designs. In a sense, we’re facing the same situation today. The cost of creating an SoC or ASIC in 65nm, 40nm, and now 32nm process technology has climbed to the tens of millions of dollars. It’s a game not everyone can play for a variety of reasons.
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Complex Digital Up Converter
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
- MIPI SWI3S Manager Core IP
Related Blogs
- Ivy Bridge: Intel's CPUs Gain a Generational Lithography Edge
- Adapteva's Epiphany Floating Point Processor Core: A Leading-Edge Lithography May Finally Open Doors
- TSMC on 450mm transition: Lithography key!
- DARPA Calls For 50X Improvement in SoC
Latest Blogs
- CNNs and Transformers: Decoding the Titans of AI
- How is RISC-V’s open and customizable design changing embedded systems?
- Imagination GPUs now support Vulkan 1.4 and Android 16
- From "What-If" to "What-Is": Cadence IP Validation for Silicon Platform Success
- Accelerating RTL Design with Agentic AI: A Multi-Agent LLM-Driven Approach