TSMC on 450mm transition: Lithography key!
TSMC unveiled its schedule for 450mm mass production at the recently held SEMICON Taiwan 2012 450mm Supply Chain Forum. Focusing on lithography as the key, Dr. C.S. Yoo, senior director of the 450mm program at TSMC, noted that IC makers and equipment suppliers should fully leverage the G450C. They need to work and innovate to make the 450mm transition a great success.
TSMC has always been in the relentless pursuit of technology innovation. It has been part of all of the computing waves that have driven the market growth. Right now, mobile computing is the leading market driver. TSMC has been helping the industry produce comprehensive, powerful mobile computing devices.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
Related Blogs
- Design impact of 450mm transition
- Is 450mm A Dead Duck?
- The Riddle Of 450mm
- What's happening on the 450mm wafer front?
Latest Blogs
- Physical AI at the Edge: A New Chapter in Device Intelligence
- Rivian’s autonomy breakthrough built with Arm: the compute foundation for the rise of physical AI
- AV1 Image File Format Specification Gets an Upgrade with AVIF v1.2.0
- Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES
- Integrating Post-Quantum Cryptography (PQC) on Arty-Z7