Is the Common Platform Alliance a credible competitor to TSMC?

By _EDA360 Insider

January 25, 2011

Last week, the Common Platform Alliance—consisting of IBM, Samsung, and GLOBALFOUNDRIES—held a Technology Forum at the Santa Clara Convention Center (SVCC) to discuss its 32/28nm process nodes now going into production (the 28nm node is mostly a straight shrink of the 32nm process node), the 20nm process node, and future plans for more advanced semiconductor-processing nodes. The keynotes and initial panel discussion took place in the SVCC’s 22,400-square-foot ballroom, which can hold as many as 3199 people when set up in a theater arrangement. I didn’t see 3000 people in the room, but it was clearly more than 1000 and it certainly felt like more than 1000 in the lunch queue. The place was packed. The keynotes were pretty darn good. It all put the Common Platform Alliance in a very professional light.

To read the full article, click here