TSMC Extends Open Innovation Platform
June 7, 2010
TSMC today extended one of the most effective semiconductor design enablement initiatives the semiconductor world has ever seen, the Open Innovation Platform (OIP). Morris Chang coined the term “OIP” himself in 2008, but the effort itself is 10+ years old with a collective cost > .5B$. My other blogs on topic include: TSMC OIP vs CDNS OIP Analysis, TSMC Open Innovation Platform Explained, and TSMC iPDK Debate.
Related Semiconductor IP
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
Related Blogs
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status
- Analog Bits Builds a Road to the Future at TSMC OIP