TSMC Extends Open Innovation Platform
TSMC today extended one of the most effective semiconductor design enablement initiatives the semiconductor world has ever seen, the Open Innovation Platform (OIP). Morris Chang coined the term “OIP” himself in 2008, but the effort itself is 10+ years old with a collective cost > .5B$. My other blogs on topic include: TSMC OIP vs CDNS OIP Analysis, TSMC Open Innovation Platform Explained, and TSMC iPDK Debate.
Related Semiconductor IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- CryptoManager Root of Trust for Use with the Caliptra Specification
- Switched Capacitor 3.6V Boost-Buck DC-DC Converter
- GlobalFoundries 22nm 3V3 GPIO
Related Blogs
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status
- Analog Bits Builds a Road to the Future at TSMC OIP
Latest Blogs
- NovaTech Automation Crius PIU: Bringing Conventional Instrument Transformers onto the IEC 61850 Process Bus
- Single Pair Ethernet and TSN: The In-Robot Network Behind the Next Humanoid Robots
- A design path to success exists for ultra-low-voltage SoCs
- Where Routine Flow Ends Veriest Formal Expertise Begins
- Securing Data Center and AI Infrastructure with CryptoManager™ Root of Trust for Use with the Caliptra™ Specification