TSMC Extends Open Innovation Platform
June 7, 2010
TSMC today extended one of the most effective semiconductor design enablement initiatives the semiconductor world has ever seen, the Open Innovation Platform (OIP). Morris Chang coined the term “OIP” himself in 2008, but the effort itself is 10+ years old with a collective cost > .5B$. My other blogs on topic include: TSMC OIP vs CDNS OIP Analysis, TSMC Open Innovation Platform Explained, and TSMC iPDK Debate.
Related Semiconductor IP
- UCIe Chiplet PHY & Controller
- MIPI D-PHY1.2 CSI/DSI TX and RX
- Low-Power ISP
- eMMC/SD/SDIO Combo IP
- DP/eDP
Related Blogs
- TSMC OIP: On the Road to the Silicon Super Chip
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms