TSMC Extends Open Innovation Platform
June 7, 2010
TSMC today extended one of the most effective semiconductor design enablement initiatives the semiconductor world has ever seen, the Open Innovation Platform (OIP). Morris Chang coined the term “OIP” himself in 2008, but the effort itself is 10+ years old with a collective cost > .5B$. My other blogs on topic include: TSMC OIP vs CDNS OIP Analysis, TSMC Open Innovation Platform Explained, and TSMC iPDK Debate.
Related Semiconductor IP
- SoC Security Platform / Hardware Root of Trust
- SPI to AHB-Lite Bridge
- Octal SPI Master/Slave Controller
- I2C and SPI Master/Slave Controller
- AHB/AXI4-Lite to AXI4-Stream Bridge
Related Blogs
- TSMC OIP: On the Road to the Silicon Super Chip
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status