Common Platform: Onward to the Future
There were keynotes from all three semiconductor partners in the Common Platform Alliance and, as if to show how common they are, they all talked about the problems that need to be addressed in the next decade and a half and they all said pretty much the same thing. Gary Patton of IBM went first and so he got to say everything first. Plus, it is clear, IBM does all the early research before technologies reach the point at which cooperative development can begin.
To read the full article, click here
Related Semiconductor IP
- 0.9V/2.5V I/O Library in TSMC 55nm
- 1.8V/3.3V Multi-Voltage GPIO in TSMC 28nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- ESD Solutions for Multi-Gigabit SerDes in TSMC 28nm
- High-Speed 3.3V I/O library with 8kV ESD Protection in TSPCo 65nm
Related Blogs
- Is the Common Platform Alliance a credible competitor to TSMC?
- TSMC Open Innovation Platform Explained
- Further Targeted Design Platform adventures
- TSMC Extends Open Innovation Platform
Latest Blogs
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security