Common Platform: Onward to the Future
March 15, 2012
There were keynotes from all three semiconductor partners in the Common Platform Alliance and, as if to show how common they are, they all talked about the problems that need to be addressed in the next decade and a half and they all said pretty much the same thing. Gary Patton of IBM went first and so he got to say everything first. Plus, it is clear, IBM does all the early research before technologies reach the point at which cooperative development can begin.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
- Bluetooth Low Energy Subsystem IP
- Multi-core capable 64-bit RISC-V CPU with vector extensions
Related Blogs
- Is the Common Platform Alliance a credible competitor to TSMC?
- TSMC Open Innovation Platform Explained
- TSMC Extends Open Innovation Platform
- Plunify launches SaaS platform that integrates FPGA design tools
Latest Blogs
- From guesswork to guidance: Mastering processor co-design with Codasip Exploration Framework
- Enabling AI Innovation at The Far Edge
- Unleashing Leading On-Device AI Performance and Efficiency with New Arm C1 CPU Cluster
- The Perfect Solution for Local AI
- UA Link vs Interlaken: What you need to know about the right protocol for AI and HPC interconnect fabrics