Common Platform: Onward to the Future
March 15, 2012
There were keynotes from all three semiconductor partners in the Common Platform Alliance and, as if to show how common they are, they all talked about the problems that need to be addressed in the next decade and a half and they all said pretty much the same thing. Gary Patton of IBM went first and so he got to say everything first. Plus, it is clear, IBM does all the early research before technologies reach the point at which cooperative development can begin.
To read the full article, click here
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related Blogs
- Is the Common Platform Alliance a credible competitor to TSMC?
- TSMC Open Innovation Platform Explained
- TSMC Extends Open Innovation Platform
- Plunify launches SaaS platform that integrates FPGA design tools
Latest Blogs
- AI is stress-testing processor architectures and RISC-V fits the moment
- Rambus Announces Industry-Leading Ultra Ethernet Security IP Solutions for AI and HPC
- The Memory Imperative for Next-Generation AI Accelerator SoCs
- Leadership in CAN XL strengthens Bosch’s position in vehicle communication
- Validating UPLI Protocol Across Topologies with Cadence UALink VIP