Ultrawideband SoCs pose new challenges to manufacturers
(10/15/2007 11:54 AM EDT) -- EE Times
What do these three killer wireless applications have in common: Viewing HDTV on a mobile device using 4G WiMax technologies; using existing WLAN infrastructure to make phone calls; and using ultrawideband (UWB) technology to download or print pictures from a digital camera?
Answer: All use a complex digital modulation scheme to transfer data over the airwaves, all are a variant of orthogonal frequency division multiplexing (OFDM) and all will become standard capabilities in the next 18 to 24 months as consumer-driven demand for wireless applications hastens convergence of mobile audio, video and data.
As advanced UWB wireless applications and ICs evolve, test technology must also evolve. ATE manufacturers need to prepare today to address test challenges on the horizon: high-end frequency coverage, broad frequency band range, high modulation bandwidth, low power levels, frequency agility and complex modulation analysis.
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related White Papers
- FPGA prototyping of complex SoCs: Partitioning and Timing Closure Challenges with Solutions
- Design Challenges Drive Need for New Routing Architecture
- Power management ICs: meeting new design paradigm challenges
- SOCs: IP is the new abstraction
Latest White Papers
- How Next-Gen Chips Are Unlocking RISC-V’s Customization Advantage
- Efficient Hardware-Assisted Heap Memory Safety for Embedded RISC-V Systems
- Automatically Retargeting Hardware and Code Generation for RISC-V Custom Instructions
- How Mature-Technology ASICs Can Give You the Edge
- Exploring the Latest Innovations in MIPI D-PHY and MIPI C-PHY