Bridging the gap between custom ASICs and ARM-based MCUs
Mark Saunders, Senior Product Marketing Manager, Cypress Semiconductor
EETimes (10/4/2010 5:53 PM EDT)
One perspective for thinking of the embedded world is as a spectrum of complexity ranging from ASIC to MCU. ASIC designs are enormously expensive and take years to complete but the potential for innovation is almost unbounded. MCU projects are almost free in comparison and take months or even just weeks to finish, but they are limited by the third-party chips they run on.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related White Papers
- Using customizable MCUs to bridge the gap between dedicated SoC ASSPs, ASICs and FPGAs: Part 1
- Using ARM Processor-based Flash MCUs as a Platform for Custom Systems-on-Chip
- Custom ASICs for Internet of Industrial Things (IoIT)
- Custom Corner Characterization for Optimal ASIC/SoC Designs
Latest White Papers
- Monolithic 3D FPGAs Utilizing Back-End-of-Line Configuration Memories
- Reimagining AI Infrastructure: The Power of Converged Back-end Networks
- 40G UCIe IP Advantages for AI Applications
- Recent progress in spin-orbit torque magnetic random-access memory
- What is JESD204C? A quick glance at the standard