Toshiba taps inSilicon's USB 2.0 core for system-on-chip designs
 |
Toshiba taps inSilicon's USB 2.0 core for system-on-chip designs
By Semiconductor Business News
October 22, 2001 (12:41 p.m. EST)
URL: http://www.eetimes.com/story/OEG20011022S0060
SAN JOSE --Intellectual property design core provider inSilicon Corp. today announced it has licensed its Universal Serial Bus (USB) 2.0 host communications core to Toshiba Corp.'s semiconductor group. Toshiba plans to use the USB 2.0 technology in complex system-on-chip designs. The deal comes after Toshiba's successful implementation of designs using inSilicon's USB 1.1 technology, said Kiyofumi Ochii, general manager of Toshiba's System LSI Design Division. Terms of the licensing pact were not released. The optimized USB 2.0 host technology will enable Toshiba to "reduce development costs and bring their advanced technology products to market sooner," said Barry Hoberman, chief operating officer of San Jose-based inSilicon.
Related Semiconductor IP
- HDCP 1.4/2.2/2.3 for DisplayPort
- HDCP 1.4/2.2/2.3
- DisplayPort transmitter IP
- DisplayPort Receiver IP
- HDMI 1.4/2.0/2.1 transmitter IP
Related News
- Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
- System Level Solutions Launches Industry-First USB 20Gbps Device IP Core
- ASMedia Technologies Achieves Industry's First SuperSpeed USB 10 Gbps (USB 3.1 Gen 2) Certified Silicon (PCIe to USB 3.1 Gen 2)
- SilabTech announces the release of its USB 3.1 Gen 2 Compliant 10 Gbps SERDES IP Core
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers